Conclusion : Apple's improvement is overall improvement whereas Snapdragon's improvement is consolidated specifically to AI related tasks.
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Liquid Glass implemented on on/off toggles ❤️
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Datamined files from BO6 Season 5 have revealed the pre-order bonuses and Vault Edition content of Black Ops 7.
The game will reportedly offer the Victor Reznov Operator with three different skins as a pre-order bonus.
BO7's Vault Edition content features four returning Operators from prior Black Ops noscripts.
@ realityuk
The game will reportedly offer the Victor Reznov Operator with three different skins as a pre-order bonus.
BO7's Vault Edition content features four returning Operators from prior Black Ops noscripts.
@ realityuk
Make Your Xiaomi Look Like iOS 26 – Liquid Glass Icons, Smooth Animations, Control Center Upgrade
https://youtu.be/TXwiKVCxnHY
https://youtu.be/TXwiKVCxnHY
https://youtu.be/TXwiKVCxnHY
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https://youtu.be/TXwiKVCxnHY
https://youtu.be/TXwiKVCxnHY
https://youtu.be/TXwiKVCxnHY
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🛰 Union Cabinet Approvals — 4 Semiconductor Projects
Total investment: ₹4,594–₹4,600 cr • Direct skilled jobs: ~2,034 • ISM total: 10 projects, ~₹1.6 lakh cr in 6 states
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📋 Project Summaries
1. SiCSem Pvt Ltd (with Clas‑SiC, UK) — Odisha
- Focus: SiC compound semiconductor fab + packaging
- Investment: ₹2,066 cr
- Capacity: 60k SiC wafers; 96 M packaged units/year
- Applications: EVs, rail, fast chargers, data centers, solar inverters, defense
- Strategic: India’s first commercial SiC fab; high‑efficiency, high‑temp devices
2. 3D Glass Solutions Inc. (3DGS) — Odisha
- Focus: Advanced packaging & embedded glass substrates
- Investment: ₹1,943 cr
- Capacity: 69,600 substrates; 50 M units; 13,200 3DHI modules/year
- Applications: HPC, AI, RF, photonics, defense
- Strategic: Brings glass‑based heterogeneous integration tech; backed by Intel, Lockheed Martin, Applied Materials
3. ASIP Technologies (with APACT, S. Korea) — Andhra Pradesh
- Focus: System‑in‑Package (SiP) manufacturing
- Investment: ₹468 cr
- Capacity: 96 M units/year
- Applications: Mobile, set‑top, automotive, consumer electronics
4. Continental Device India Ltd (CDIL) — Punjab
- Focus: Discrete high‑power semiconductors (Si & SiC)
- Investment: ₹117 cr
- Capacity: 158.38 M devices/year (MOSFETs, IGBTs, Schottky, transistors)
- Applications: EVs, renewables, industrial automation, comms infra
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🏗 Timelines & Clusters
- Buildout: 12–36 months (packaging faster, fabs longer)
- Odisha cluster: SiC fab + advanced packaging co‑located in Info Valley for wafer‑to‑module efficiency
- Ecosystem: 278 academic institutes, 72 chip‑design startups, 60k+ trained students feed talent pipeline
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🔍 Strategic Impact
- SiC devices: Energy‑efficient, high‑temp use in EV inverters, rail traction, aerospace, defense; reduces import reliance amid global shortages
- Advanced/glass packaging: Improves thermal, signal integrity, density for AI/HPC & RF; moves India up value chain
- SiP manufacturing: Enables miniaturized, multi‑chip integration for high‑volume consumer & automotive markets
- Power discretes: Local supply supports EV, renewable, and industrial power conversion resilience
Total investment: ₹4,594–₹4,600 cr • Direct skilled jobs: ~2,034 • ISM total: 10 projects, ~₹1.6 lakh cr in 6 states
---
📋 Project Summaries
1. SiCSem Pvt Ltd (with Clas‑SiC, UK) — Odisha
- Focus: SiC compound semiconductor fab + packaging
- Investment: ₹2,066 cr
- Capacity: 60k SiC wafers; 96 M packaged units/year
- Applications: EVs, rail, fast chargers, data centers, solar inverters, defense
- Strategic: India’s first commercial SiC fab; high‑efficiency, high‑temp devices
2. 3D Glass Solutions Inc. (3DGS) — Odisha
- Focus: Advanced packaging & embedded glass substrates
- Investment: ₹1,943 cr
- Capacity: 69,600 substrates; 50 M units; 13,200 3DHI modules/year
- Applications: HPC, AI, RF, photonics, defense
- Strategic: Brings glass‑based heterogeneous integration tech; backed by Intel, Lockheed Martin, Applied Materials
3. ASIP Technologies (with APACT, S. Korea) — Andhra Pradesh
- Focus: System‑in‑Package (SiP) manufacturing
- Investment: ₹468 cr
- Capacity: 96 M units/year
- Applications: Mobile, set‑top, automotive, consumer electronics
4. Continental Device India Ltd (CDIL) — Punjab
- Focus: Discrete high‑power semiconductors (Si & SiC)
- Investment: ₹117 cr
- Capacity: 158.38 M devices/year (MOSFETs, IGBTs, Schottky, transistors)
- Applications: EVs, renewables, industrial automation, comms infra
---
🏗 Timelines & Clusters
- Buildout: 12–36 months (packaging faster, fabs longer)
- Odisha cluster: SiC fab + advanced packaging co‑located in Info Valley for wafer‑to‑module efficiency
- Ecosystem: 278 academic institutes, 72 chip‑design startups, 60k+ trained students feed talent pipeline
---
🔍 Strategic Impact
- SiC devices: Energy‑efficient, high‑temp use in EV inverters, rail traction, aerospace, defense; reduces import reliance amid global shortages
- Advanced/glass packaging: Improves thermal, signal integrity, density for AI/HPC & RF; moves India up value chain
- SiP manufacturing: Enables miniaturized, multi‑chip integration for high‑volume consumer & automotive markets
- Power discretes: Local supply supports EV, renewable, and industrial power conversion resilience
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