Tech Office : Updates & Tech News ~1 – Telegram
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🛰 Union Cabinet Approvals — 4 Semiconductor Projects

Total investment: ₹4,594–₹4,600 cr • Direct skilled jobs: ~2,034 • ISM total: 10 projects, ~₹1.6 lakh cr in 6 states

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📋 Project Summaries

1. SiCSem Pvt Ltd (with Clas‑SiC, UK) — Odisha

- Focus: SiC compound semiconductor fab + packaging
- Investment: ₹2,066 cr
- Capacity: 60k SiC wafers; 96 M packaged units/year
- Applications: EVs, rail, fast chargers, data centers, solar inverters, defense
- Strategic: India’s first commercial SiC fab; high‑efficiency, high‑temp devices

2. 3D Glass Solutions Inc. (3DGS) — Odisha

- Focus: Advanced packaging & embedded glass substrates
- Investment: ₹1,943 cr
- Capacity: 69,600 substrates; 50 M units; 13,200 3DHI modules/year
- Applications: HPC, AI, RF, photonics, defense
- Strategic: Brings glass‑based heterogeneous integration tech; backed by Intel, Lockheed Martin, Applied Materials

3. ASIP Technologies (with APACT, S. Korea) — Andhra Pradesh

- Focus: System‑in‑Package (SiP) manufacturing
- Investment: ₹468 cr
- Capacity: 96 M units/year
- Applications: Mobile, set‑top, automotive, consumer electronics

4. Continental Device India Ltd (CDIL) — Punjab

- Focus: Discrete high‑power semiconductors (Si & SiC)
- Investment: ₹117 cr
- Capacity: 158.38 M devices/year (MOSFETs, IGBTs, Schottky, transistors)
- Applications: EVs, renewables, industrial automation, comms infra

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🏗 Timelines & Clusters

- Buildout: 12–36 months (packaging faster, fabs longer)
- Odisha cluster: SiC fab + advanced packaging co‑located in Info Valley for wafer‑to‑module efficiency
- Ecosystem: 278 academic institutes, 72 chip‑design startups, 60k+ trained students feed talent pipeline

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🔍 Strategic Impact

- SiC devices: Energy‑efficient, high‑temp use in EV inverters, rail traction, aerospace, defense; reduces import reliance amid global shortages
- Advanced/glass packaging: Improves thermal, signal integrity, density for AI/HPC & RF; moves India up value chain
- SiP manufacturing: Enables miniaturized, multi‑chip integration for high‑volume consumer & automotive markets
- Power discretes: Local supply supports EV, renewable, and industrial power conversion resilience
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Pixel 10 Pro Fold | Google Official
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🏦 Jio Finance x TaxBuddy — Income Tax Planning & Filing

Launch: 11–12 Aug 2025 • Platform: JioFinance App • Partner: TaxBuddy

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1️⃣ Overview

Jio Financial Services Ltd. (JFSL) has added a Tax Planning & Filing module in its app to:

- Simplify ITR filing
- Provide year‑round tax planning
- Disrupt the market with ultra‑low pricing

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2️⃣ Core Features

Tax Planner : Forecast tax, compare Old/New regime, HRA calc, deductions (80C, 80D) | Optimises tax savings

Tax Filing : Self‑service from ₹24, expert‑assisted from ₹999, guided workflow | Affordable, easy filing

Post‑Filing Tools : Refund tracking, IT notice alerts, return status | Boosts compliance

UX : Digital‑first, compliance checks, transparent pricing | Reduces errors & builds trust

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3️⃣ Price Benchmark

| Type | JioFinance | Competitors |

|----------|-------------------|----------------------|

| Self‑service | ₹24 | ₹199–₹499 |

| Expert‑assisted | ₹999 | ₹799–₹2,000+ |

| Premium Advisory | TBA | ₹3,000+ |

💡 Edge: ₹24 + integrated planning challenges both mid‑tier private and free government options.

---

4️⃣ Filing Workflow

1. Open JioFinance → Tax Planning & Filing
2. Pick mode → Self or Expert
3. Add income details
4. Upload proofs (Form 16, rent receipts, etc.)
5. Compare Old vs New regime
6. Review & file with e‑verify
7. Track refunds, notices

---

5️⃣ Strategic Significance

For JFSL:
- Expands into compliance & advisory
- Builds annual user stickiness
- Positions as low‑cost disruptor

For Users:
- Democratizes advanced tax tools
- Cuts risk of missed deductions
- Year‑round tax visibility

---

6️⃣ Global Parallels

- US: Cash App Taxes — free, filing only
- Australia: myTax — free, no advisory
- Jio’s Unique Play: Planning + filing + advisory at ultra‑low cost, in a consumer app
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A18 pro iPhone 16 pro chip
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🟥https://youtu.be/ueMVgglqnek
🟥https://youtu.be/ueMVgglqnek
🟥https://youtu.be/ueMVgglqnek



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🇮🇳 India’s Leap into Advanced Chip Design
7 nm → 5 nm → 3 nm


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🚀 The Breakthrough

- First-ever 3 nm chip design in India by Renesas Electronics India.
- Launch: 13 May 2025, Noida & Bengaluru centres.
- Builds on earlier 7 nm and 5 nm commercial design successes.

---

🧠 Why It Matters

| Feature | 7 nm | 5 nm | 3 nm |

|---------|------|------|------|

| Density | ~96M/mm² | ~171M/mm² | Up to 250M/mm² |

| Perf. | High | Higher | Highest yet |

| Power Use | Good | Better | Best |

| Apps | Phones, servers | AI, flagships | AI, 5G/6G, med/defence |

Impact: Higher speed, lower power, denser logic for next-gen devices.

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🏗️ Ecosystem Moves

1️⃣ Talent & Design

- Renesas–MeitY MoU → 270+ institutes to get microcontroller kits.
- Complements earlier EDA software rollouts under the India Semiconductor Mission.

2️⃣ Manufacturing & Packaging

- OSAT JV in Gujarat: Renesas + CG Power + Stars Microelectronics.
- ₹7,600+ cr over 5 years.
- Capacity: 15M chips/day.

3️⃣ Govt. Strategy

- Covering design → fab → ATMP → supply chains.
- Drawing global majors (Applied Materials, Lam Research) to India.

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🌏 Strategic Upshot

1. Elite Club Entry – 3 nm design nations: US, Taiwan, S. Korea, now India.
2. Value Chain Rise – From consumer → IP-rich designer.
3. Talent Depth – HW+SW skills pipeline.
4. Backend Base – Local OSAT reduces overseas reliance.
5. Sector Gains – Phones, EVs, AI, defence, space.

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⚠️ Execution Risks

| Risk | Why Critical | Mitigation |

|------|--------------|------------|

No local 3 nm fab | Sovereignty gap | Partner w/ TSMC, Samsung; build domestic fabs

Skill gap | Advanced VLSI talent scarce | Expand curriculum, attract diaspora

High capex | $15–20B per fab | PLI, JVs, sovereign funds

Rapid node shifts | 3 nm → sub‑2 nm fast | Invest in GAAFET, 2D materials R&D |

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📅 Timeline

Year | Milestone

------|-----------

Pre‑2023 | 28–14 nm; early 7 nm

2023–24 | 7 nm & 5 nm designs; OSAT JV announced

May 2025 | 3 nm design centres launched

2026–28 (proj.) | Overseas pilot production; domestic fab groundwork
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🖥️ 🇨🇳 BOE Guilty of Stealing 🇰🇷 Samsung OLED Trade Secrets

Source: U.S. International Trade Commission (ITC) — Initial Determination 11 Jul 2025
Final Ruling: Expected Nov 2025

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1️⃣ Executive Snapshot

Ruling Body : US ITC

Accused : BOE + 7 subsidiaries

Charge : Misappropriation of Samsung Display’s OLED trade secrets

Outcome : Guilty — prelim ruling

Sanctions : 14y 8m limited exclusion order + cease‑and‑desist

Impact : Ban on BOE OLED imports & US marketing/sales

Note : Panels often arrive embedded in phones — complicates direct enforcement

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2️⃣ How BOE Allegedly Obtained Tech

- Ex‑Samsung hires with insider process knowledge
- Supplier pressure for confidential data
- Rapid replication of Samsung’s proprietary OLED stack/process

💡 Focus is on trade secrets, not patents — enabling longer, broader remedies.

---

3️⃣ Orders & Scope

Limited Exclusion Order (LEO)

- Duration (14 years and 8 months) matches Samsung’s development timeline
- Blocks import of BOE OLED panels into US

Cease‑and‑Desist Order (CDO)

- Targets US subsidiaries
- Prohibits marketing, selling, distributing panels in US — including existing inventory

Enforcement wrinkle: Panels embedded in finished goods (e.g., iPhones) may evade border checks unless downstream products are targeted.

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4️⃣ Timeline

2024 : ITC found BOE infringed 3 Samsung OLED patents (no ban)

11 Jul 25 : Prelim ITC ruling: BOE guilty of trade secret theft

Nov 25 : Final ruling due — prelim findings rarely overturned

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5️⃣ OLED Supply Impact — iPhone Q2 2025

| Supplier | Share % |
|------------------|---------|
| Samsung Display | 56.0 |
| LG Display | 21.3 |
| BOE | 22.7 |

If ban holds:

- Apple may shift US‑bound orders to Samsung/LG → Korean share rises
- China‑only iPhones may still use BOE
- Reduced competition could lift panel prices
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As per rumours
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- MTK D7060
- 6GB/128GB, LPDDR5/UFS3.1
- 50MP
- 5000mAh + 33W USB-C
- Stereo
- IR Blaster
- UD FP Sensor
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🏭 National Manufacturing Mission — Draft Brief

📌 Snapshot

Purpose : Unified mission to accelerate Make in India via policy, execution roadmaps, and strong governance

Status : Draft finalized by NITI Aayog; inter‑ministerial consultations done; launch imminent

Governance : Empowered body with clearance powers to coordinate Centre–State execution

Five Pillars : Ease & cost of doing business • Future‑ready workforce • Vibrant MSMEs • Technology access • Product quality

Focus : 15 labour‑intensive sectors + clean‑tech manufacturing

Linked Schemes : Footwear & Leather Focus Product Scheme • National Action Plan for Toys

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🎯 Design & Scope

- Covers SMEs to large industries; aligns central & state efforts.
- Pillars in action: cut cost stack (logistics, power, compliance, finance); skill workers to factory needs; deepen MSME finance & markets; expand tech access; align quality standards with global norms.

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🏷️ Sector Thrusts

Labour‑Intensive : Auto components, leather, footwear, light engineering — for jobs & exports

Clean‑Tech : Solar PV, EV batteries, motors/controllers, electrolyzers, wind turbines, VHV grid gear, grid‑scale batteries

Footwear & Leather Scheme : ₹4 lakh cr turnover • ₹1.1 lakh cr exports • 22 lakh jobs

Toys Action Plan : Global hub positioning, cluster & quality focus

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📅 Status

- Draft ready with ministry inputs
- Launch expected soon; tied to Union Budget 2025–26
- 🏛 Governance body to monitor and fast‑track decisions

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📊 Potential Impact

- Cost Competitiveness — reduce factory‑gate costs
- Job Creation — in employment‑heavy sectors
- Strategic Depth — localised clean‑tech supply chains

👀Proposed KPIs

Factory‑Gate Cost Index : Benchmark competitiveness

Time‑to‑Commission : Approvals → production speed

Domestic Value Addition : Local content in clean‑tech

Export Intensity : % output exported

MSME Credit Flow : Depth of financial access

Skills Conversion Rate : Training → job placement in ≤90 days

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⚠️ Key Risks & 🔑 Mitigation

Centre–State friction : SLA‑bound compacts + performance grants

Policy overlap : Rationalise PLIs & cluster schemes

Standards gap : BIS–IEC/ISO alignment + lab upgrades

Skills mismatch : OEM‑designed curricula, productivity metrics

Capex without demand : Anchor‑buyer pacts & procurement pipelines

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🔭 Watchpoints

- Official NMM mandate & powers
- Final list of targeted sectors & tools
- Clean‑tech DVA thresholds
- State participation in SLA compacts
- Public KPI dashboards from launch
- Integration with PLIs, FTAs, logistics policy
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