Spotify is introducing new audio previews and real-time song sharing features for Instagram.
The Audio previews feature lets you share any Spotify song as your Instagram Story with an audio snippet.
The real-time sharing feature lets you have your currently playing Spotify tracks show up on Instagram Notes.
The Audio previews feature lets you share any Spotify song as your Instagram Story with an audio snippet.
The real-time sharing feature lets you have your currently playing Spotify tracks show up on Instagram Notes.
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removing titanium
Aluminium comeback
It’s highly recyclable
17 Pro series
Aluminium comeback
It’s highly recyclable
17 Pro series
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Apple to Simplify iPhone 18 Camera Control Button, Not Remove It
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Inside the ROG Xbox Ally: Game Access and Compatibility
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First Look: Windows 11's new Handheld Gaming Mode on the Xbox Ally!
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23 chip design projects just approved under India’s Design Linked Incentive (DLI) Scheme
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🛠 What is the DLI Scheme?
- Launched: December 2021
- Budget: ₹1,000 crore (part of the ₹76,000 crore Semicon India Programme)
- Goal: Support domestic companies, startups, MSMEs, and academic institutions in semiconductor design — from concept to commercialisation.
- Incentives:
- Up to 50% of eligible costs for prototyping (capped at ₹15 crore per application)
- 4–6% of net sales turnover for 5 years (capped at ₹30 crore)
- Support Infrastructure: Access to advanced Electronic Design Automation (EDA) tools and IP cores for chip design.
- EDA Access: 72 companies now have industry-grade EDA tools to accelerate design.
- Total Outlay (including tools): ₹803.08 crore.
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The Approved Projects
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⚡ Power Electronics & Energy
- SiCSem – Silicon carbide-based power devices → EVs, renewable energy
- Vervesemi Microelectronics – Smart energy metering ASIC → Utilities, smart grids
- MSME (undisclosed) – Power management IC → Consumer electronics
- Vervesemi Microelectronics – BLDC motor controller ASIC → Fans, appliances
- Vervesemi Microelectronics – Precision motor-control ASIC → EVs, drones, industrial automation
- MSME (undisclosed) – Industrial motor driver IC → Factory automation
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🧠 AI, Analytics & Processing
- Startup (undisclosed) – AI-enabled video analytics chip → Defence, traffic monitoring
- MSME (undisclosed) – Edge AI accelerator chip → Retail analytics, robotics
- MSME (undisclosed) – Secure cryptographic processor → Fintech, defence
- MSME (undisclosed) – Microprocessor IP core → Embedded systems, computing
- MSME (undisclosed) – FPGA-based prototyping platform → Defence, aerospace
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📡 Connectivity & Communication
- MSME (undisclosed) – Networking switch ASIC → Data centres, telecom
- MSME (undisclosed) – Smart meter communication SoC → Utilities, IoT
- MSME (undisclosed) – GNSS receiver chip → Navigation, drones
- MSME (undisclosed) – Wireless communication transceiver → 5G/6G, IoT
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👁 Imaging, Sensing & Control
- Vervesemi Microelectronics – ASIC for weighing scales & bridge sensors → Industrial weighing, force-touch devices
- Vervesemi Microelectronics – Multifunction data acquisition ASIC → Aerospace, avionics
- Startup (undisclosed) – Surveillance camera SoC → Security, smart cities
- MSME (undisclosed) – Low-power IoT sensor hub → Wearables, smart homes
- MSME (undisclosed) – Automotive radar signal processor → ADAS, autonomous driving
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🏗 Packaging & Integration
- 3D Glass Solutions Inc. – Advanced glass-based IC packaging → High-frequency RF, 5G/6G
- Advanced System in Package (ASIP) Technologies – System-in-Package solutions → IoT, telecom, industrial
- Continental Device India Pvt. Ltd (CDIL) – Discrete semiconductors & ICs → Consumer electronics, automotive
---
🛠 What is the DLI Scheme?
- Launched: December 2021
- Budget: ₹1,000 crore (part of the ₹76,000 crore Semicon India Programme)
- Goal: Support domestic companies, startups, MSMEs, and academic institutions in semiconductor design — from concept to commercialisation.
- Incentives:
- Up to 50% of eligible costs for prototyping (capped at ₹15 crore per application)
- 4–6% of net sales turnover for 5 years (capped at ₹30 crore)
- Support Infrastructure: Access to advanced Electronic Design Automation (EDA) tools and IP cores for chip design.
- EDA Access: 72 companies now have industry-grade EDA tools to accelerate design.
- Total Outlay (including tools): ₹803.08 crore.
---
The Approved Projects
---
⚡ Power Electronics & Energy
- SiCSem – Silicon carbide-based power devices → EVs, renewable energy
- Vervesemi Microelectronics – Smart energy metering ASIC → Utilities, smart grids
- MSME (undisclosed) – Power management IC → Consumer electronics
- Vervesemi Microelectronics – BLDC motor controller ASIC → Fans, appliances
- Vervesemi Microelectronics – Precision motor-control ASIC → EVs, drones, industrial automation
- MSME (undisclosed) – Industrial motor driver IC → Factory automation
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🧠 AI, Analytics & Processing
- Startup (undisclosed) – AI-enabled video analytics chip → Defence, traffic monitoring
- MSME (undisclosed) – Edge AI accelerator chip → Retail analytics, robotics
- MSME (undisclosed) – Secure cryptographic processor → Fintech, defence
- MSME (undisclosed) – Microprocessor IP core → Embedded systems, computing
- MSME (undisclosed) – FPGA-based prototyping platform → Defence, aerospace
---
📡 Connectivity & Communication
- MSME (undisclosed) – Networking switch ASIC → Data centres, telecom
- MSME (undisclosed) – Smart meter communication SoC → Utilities, IoT
- MSME (undisclosed) – GNSS receiver chip → Navigation, drones
- MSME (undisclosed) – Wireless communication transceiver → 5G/6G, IoT
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👁 Imaging, Sensing & Control
- Vervesemi Microelectronics – ASIC for weighing scales & bridge sensors → Industrial weighing, force-touch devices
- Vervesemi Microelectronics – Multifunction data acquisition ASIC → Aerospace, avionics
- Startup (undisclosed) – Surveillance camera SoC → Security, smart cities
- MSME (undisclosed) – Low-power IoT sensor hub → Wearables, smart homes
- MSME (undisclosed) – Automotive radar signal processor → ADAS, autonomous driving
---
🏗 Packaging & Integration
- 3D Glass Solutions Inc. – Advanced glass-based IC packaging → High-frequency RF, 5G/6G
- Advanced System in Package (ASIP) Technologies – System-in-Package solutions → IoT, telecom, industrial
- Continental Device India Pvt. Ltd (CDIL) – Discrete semiconductors & ICs → Consumer electronics, automotive
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