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23 chip design projects just approved under India’s Design Linked Incentive (DLI) Scheme
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🛠 What is the DLI Scheme?
- Launched: December 2021
- Budget: ₹1,000 crore (part of the ₹76,000 crore Semicon India Programme)
- Goal: Support domestic companies, startups, MSMEs, and academic institutions in semiconductor design — from concept to commercialisation.
- Incentives:
- Up to 50% of eligible costs for prototyping (capped at ₹15 crore per application)
- 4–6% of net sales turnover for 5 years (capped at ₹30 crore)
- Support Infrastructure: Access to advanced Electronic Design Automation (EDA) tools and IP cores for chip design.
- EDA Access: 72 companies now have industry-grade EDA tools to accelerate design.
- Total Outlay (including tools): ₹803.08 crore.
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The Approved Projects
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⚡ Power Electronics & Energy
- SiCSem – Silicon carbide-based power devices → EVs, renewable energy
- Vervesemi Microelectronics – Smart energy metering ASIC → Utilities, smart grids
- MSME (undisclosed) – Power management IC → Consumer electronics
- Vervesemi Microelectronics – BLDC motor controller ASIC → Fans, appliances
- Vervesemi Microelectronics – Precision motor-control ASIC → EVs, drones, industrial automation
- MSME (undisclosed) – Industrial motor driver IC → Factory automation
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🧠 AI, Analytics & Processing
- Startup (undisclosed) – AI-enabled video analytics chip → Defence, traffic monitoring
- MSME (undisclosed) – Edge AI accelerator chip → Retail analytics, robotics
- MSME (undisclosed) – Secure cryptographic processor → Fintech, defence
- MSME (undisclosed) – Microprocessor IP core → Embedded systems, computing
- MSME (undisclosed) – FPGA-based prototyping platform → Defence, aerospace
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📡 Connectivity & Communication
- MSME (undisclosed) – Networking switch ASIC → Data centres, telecom
- MSME (undisclosed) – Smart meter communication SoC → Utilities, IoT
- MSME (undisclosed) – GNSS receiver chip → Navigation, drones
- MSME (undisclosed) – Wireless communication transceiver → 5G/6G, IoT
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👁 Imaging, Sensing & Control
- Vervesemi Microelectronics – ASIC for weighing scales & bridge sensors → Industrial weighing, force-touch devices
- Vervesemi Microelectronics – Multifunction data acquisition ASIC → Aerospace, avionics
- Startup (undisclosed) – Surveillance camera SoC → Security, smart cities
- MSME (undisclosed) – Low-power IoT sensor hub → Wearables, smart homes
- MSME (undisclosed) – Automotive radar signal processor → ADAS, autonomous driving
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🏗 Packaging & Integration
- 3D Glass Solutions Inc. – Advanced glass-based IC packaging → High-frequency RF, 5G/6G
- Advanced System in Package (ASIP) Technologies – System-in-Package solutions → IoT, telecom, industrial
- Continental Device India Pvt. Ltd (CDIL) – Discrete semiconductors & ICs → Consumer electronics, automotive
---
🛠 What is the DLI Scheme?
- Launched: December 2021
- Budget: ₹1,000 crore (part of the ₹76,000 crore Semicon India Programme)
- Goal: Support domestic companies, startups, MSMEs, and academic institutions in semiconductor design — from concept to commercialisation.
- Incentives:
- Up to 50% of eligible costs for prototyping (capped at ₹15 crore per application)
- 4–6% of net sales turnover for 5 years (capped at ₹30 crore)
- Support Infrastructure: Access to advanced Electronic Design Automation (EDA) tools and IP cores for chip design.
- EDA Access: 72 companies now have industry-grade EDA tools to accelerate design.
- Total Outlay (including tools): ₹803.08 crore.
---
The Approved Projects
---
⚡ Power Electronics & Energy
- SiCSem – Silicon carbide-based power devices → EVs, renewable energy
- Vervesemi Microelectronics – Smart energy metering ASIC → Utilities, smart grids
- MSME (undisclosed) – Power management IC → Consumer electronics
- Vervesemi Microelectronics – BLDC motor controller ASIC → Fans, appliances
- Vervesemi Microelectronics – Precision motor-control ASIC → EVs, drones, industrial automation
- MSME (undisclosed) – Industrial motor driver IC → Factory automation
---
🧠 AI, Analytics & Processing
- Startup (undisclosed) – AI-enabled video analytics chip → Defence, traffic monitoring
- MSME (undisclosed) – Edge AI accelerator chip → Retail analytics, robotics
- MSME (undisclosed) – Secure cryptographic processor → Fintech, defence
- MSME (undisclosed) – Microprocessor IP core → Embedded systems, computing
- MSME (undisclosed) – FPGA-based prototyping platform → Defence, aerospace
---
📡 Connectivity & Communication
- MSME (undisclosed) – Networking switch ASIC → Data centres, telecom
- MSME (undisclosed) – Smart meter communication SoC → Utilities, IoT
- MSME (undisclosed) – GNSS receiver chip → Navigation, drones
- MSME (undisclosed) – Wireless communication transceiver → 5G/6G, IoT
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👁 Imaging, Sensing & Control
- Vervesemi Microelectronics – ASIC for weighing scales & bridge sensors → Industrial weighing, force-touch devices
- Vervesemi Microelectronics – Multifunction data acquisition ASIC → Aerospace, avionics
- Startup (undisclosed) – Surveillance camera SoC → Security, smart cities
- MSME (undisclosed) – Low-power IoT sensor hub → Wearables, smart homes
- MSME (undisclosed) – Automotive radar signal processor → ADAS, autonomous driving
---
🏗 Packaging & Integration
- 3D Glass Solutions Inc. – Advanced glass-based IC packaging → High-frequency RF, 5G/6G
- Advanced System in Package (ASIP) Technologies – System-in-Package solutions → IoT, telecom, industrial
- Continental Device India Pvt. Ltd (CDIL) – Discrete semiconductors & ICs → Consumer electronics, automotive
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