POCO F7 Last Official HyperOS 2.0.205 OTA Update Review | HyperOS 3.0 Coming


https://youtu.be/vlw2zKt-Hzw
https://youtu.be/vlw2zKt-Hzw
https://youtu.be/vlw2zKt-Hzw

Download link
Link1 , Link2

Free ChatGPT Go access for a year, starting November 4th.

POCO F7 Official HyperOS 3 Update Review Cn Version, Super Doper Smooth


https://youtu.be/fks0v2qbZe0
https://youtu.be/fks0v2qbZe0
https://youtu.be/fks0v2qbZe0

Download Link
Official HyperOS 3.0.4 Stable update
Link1 , Link2

Rumor: Meta is reportedly considering purchasing Google’s TPUs.

Regardless of whether the deal materializes, Google (through Broadcom) has been raising its planned TSMC CoWoS wafer starts every month for next year.

Rumor: Snapdragon 8 Elite Gen 6 will skip TSMC’s N2 node and go straight to N2P.

Memory support will go up to LPDDR6 + UFS 5.0.

Apple reportedly shows no interest in TSMC’s A16 process… NVIDIA likely to be the first to use the A16 node (Korean local media report)

Rumor: About Galaxy Z Fold 8

• Battery capacity in the 5000mAh range
• To improve display crease, it will adopt a laser-drilled metal plate technology, similar to the one used in the foldable iPhone
• S Pen support to be reinstated

A Samsung Galaxy S25+ exploded in South Korea.

Are the ghosts of the Galaxy Note 7 haunting Koreans?

⚡ TSMC CoWoS, Nvidia & Broadcom

🔹 What is CoWoS?

- TSMC’s 2.5D packaging tech (Chip-on-Wafer-on-Substrate).
- Connects logic + HBM via silicon interposer → ultra-high bandwidth, low latency, power efficiency.

🔹 Nvidia

- Uses CoWoS for Hopper & Blackwell GPUs.
- Shifting from CoWoS-S → CoWoS-L for better yield & scalability.
- By 2026: ~595k wafers, ~60% of TSMC’s CoWoS capacity (510k CoWoS-L).
- Creates supply bottlenecks for others.

🔹 Broadcom

- Applies CoWoS to networking chips (Tomahawk, Jericho) & custom AI ASICs for hyperscalers.
- Faces allocation pressure due to Nvidia’s dominance.

🔹 Industry Impact

- Global demand → 1M wafers by 2026.
- TSMC expanding capacity; rivals explore Intel EMIB/Foveros & Samsung I-Cube.

✅ Bottom line:

CoWoS is the backbone of the AI boom—Nvidia leads, Broadcom competes, and TSMC holds the keys.