Tech Office : Updates & Tech News ~1 – Telegram
Tech Office : Updates & Tech News ~1
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OnePlus 13 has a lot of upgrades over OnePlus 12. However, there are some silent omissions.

Some of the changes

There is no 60fps recording in 720p. Pixelworks X7 chipset is missing due to which no hyper resolution is absent in OnePlus 13.
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Tech Office : Updates & Tech News ~1
Xiaomi 15 Ultra first look
Xiaomi 15 Ultra 🔥

Specs:-
📱6.7" 120hz 2k Quad Curved LTPO OLED DISPLAY
🔳 Snapdragon 8 Elite
📷 50MP LYT900 (f/1.6, 23mm) + 50MP JN5 (UW) + 50MP IMX858(2.6x) + 200MP HP9 (f/2.6, 4.3x)
🤳 32MP Front (OV32B40)
🔋6000mAh +90W wired + 80W wireless
🏊 IP68
🔳 P3 fast charging chip, G1 battery management chip, T1 signal management chip
📶 Wi-Fi 7, Bluetooth 5.4, NFC, IR blaster, 🔑 Ultrasonic fingerprint
HyperOS 2.0 Based on A15
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Motorola Razr 50 Ultra is now available for Rs 69,999 after a price drop of Rs 30k.

- Offer available via Reliance Digital online, offline stores

- Valid until January 26.

- Aditional Rs 2,500 off through bank offers

- The company is also bundling Moto Buds+ worth Rs 9,999 free in the box.

- There is also a no-cost EMI option with select banks, with EMI starting at Rs 5,833 per month


#Motorola #MotorolaRazr50Ultra
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JioSoundPay now on JioBharat:

Get instant sound alerts for UPI payments received on your JioBharat. #jio #upi
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Forwarded from Tech Star Updates | Leaks & TechNews (Tech Star)
iQOO Neo 10R coming soon
Poster surfaced on Amazon.

Specifications for india 🇮🇳

IQOO NEO 10R 5G (India)

I2221
6.78" AMOLED 144hz
8s Gen 3
8GB+256GB, 12GB+256GB
50MP Sony LYT-600, 8MP wide, 16MP front
6400 mAh / 80W
Blue white Slice, Lunar Titanium

Under 30K
Feb 2025

#IQOO #IQOONeo10R #IQQNEO10R5G
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Forwarded from Tech Star Updates | Leaks & TechNews (Tech Star)
Xiaomi 15 Ultra camera samples.

Quality reduced twice while downloading & unloading


#Xiaomi #Xiaomi15Ultra
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Samsung Securities also commented on DeepSeek in this report as follows:

“DeepSeek has gained attention for the cost-efficiency of its V3 model. The V3 model has 1.5 times the parameter size of Meta’s Llama but used only one-tenth of the GPUs for training, and it was developed at a low training cost of $5.57 million using H800 GPUs.

While some claim that DeepSeek highlights a shortage of GPUs, others argue that it likely utilized as many as 50,000 H100 GPUs. However, it is worth noting that the U.S. restrictions on China’s semiconductor imports have pushed China to focus on efficiency and cost-effectiveness, leading to the development of models and breakthroughs in model architectures and methodologies.

In addition to DeepSeek, Alibaba’s Qwen and Kimi are also claimed to possess top-tier (o1-level) inference models. On the other hand, in the U.S., apart from OpenAI, the only other significant inference model output is from Google.”
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iOS 18 is so stable
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Nikkei: China’s Huawei partners accelerate ‘HBM self-development.’

• Nikkei Asia reported that Chinese memory semiconductor companies such as Tongfu Microelectronics and CXMT have recently achieved results in commercializing HBM independently and have started production.

Currently, China’s HBM technology is said to lag several years behind global leading memory semiconductor companies in terms of performance, power efficiency, and cost.

Nikkei Asia stated, “Tongfu aims to secure technology that can rival SK Hynix, Samsung Electronics, and Micron, and has begun pursuing this goal.”

Display manufacturer BOE is also reported to have secured advanced packaging technology for assembling AI semiconductors and HBM into finished products, entering pilot production.

Nikkei Asia added, “BOE is increasing its investment in semiconductor-related fields and focusing on technological advancement, but it may take some time to confirm tangible results.”
SK Hynix: Clear HBM Leadership, Target Price Raised to 280,000 KRW (JPM)

1. HBM Growth Expectations Driven by ASIC
• Encouraging outlook as HBM revenue is expected to double by 2025, driven by the 12-layer HBM3E bit crossover in 1H25E.
• Contrary to initial expectations, the migration to AI inference is not slowing HBM demand, as seen in Hynix’s adoption of advanced HBM3E with several ASIC customers.
• In the HBM4 roadmap, mass production of 12-layer HBM4 is planned for 2025, and 16-layer HBM4 for the second half of 2026. Due to strong yield improvements, there is a high likelihood that 1cnm technology will be adopted for HBM4E.
• Visibility of HBM demand for Hynix is expected to extend into 2026–2027, maintaining a constructive view on its HBM business leadership.
• With increasing HBM orders from ASIC customers by 2026, the HBM mix is projected to rise to 60% in 2026 (from 52% in 2025), improving both profitability and earnings visibility, potentially acting as a re-rating catalyst.
• Notably, discussions on 2026 HBM orders with current customers are underway and are expected to conclude by 2Q25E.

2. Intensifying Downcycle in Commodity Memory
• Hynix appears to have lowered its seasonal bit growth rate to below 1% and adjusted its 2025 DRAM/NAND bit demand guidance, partly due to mounting inventory pressure on mobile/PC customers caused by CXMT’s aggressive legacy capacity expansion.
• Management reaffirmed their view that traditional recovery will occur in 2H25, driven by Edge-AI adoption that increases content, with AI smartphone/PC penetration expected to reach 30–40% and 30%, respectively.
• Regarding competition from China, the impact of CXMT on DDR5 is expected to remain limited due to restrictions on access to advanced equipment. Legacy DRAM’s contribution to revenue is forecasted to drop below 10% in 2025 (from over 20% in 2024), leading to improved profitability.
• Overall, the outlook for a shorter memory downcycle remains unchanged, with a steeper correction in 1H25 followed by gradual recovery in 2H25.

3. CapEx/WFE Spending Updates
• Infrastructure investment in 2025 is expected to grow significantly, with a higher allocation to HBM compared to WFE spending.
• Due to limited cleanroom space, Hynix plans to complete the M15X and Yongin fabs by 4Q25E and 2Q27E, respectively.
• Hynix’s capital allocation plan prioritizes HBM, and the relatively resilient DDR5 server demand is expected to mitigate the impact of oversupply in traditional DRAM in 2025.

4. Target Price Raised by 27% to 280,000 KRW
• Reflecting upward revisions in HBM revenue, the company’s leadership in HBM, and the increase in HBM TAM driven by ASIC opportunities, there is ample room for stock price appreciation.
• Once updates on 2026 HBM orders are clarified, demand visibility and strong profitability are expected to lead to upward revisions in earnings forecasts.
Amazon has quietly removed protections for Black and LGBTQ+ workers from its company policies.
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One by one, the richest companies in America are cutting back on their commitment to protecting the rights of Black people and the LGBTQ+ community.

Amazon is the latest.

Statements saying Amazon supported the rights of transgender people and would protect the safety of Black employees and customers are gone from the companies webpage now.

All of this because a racist and a homophobe, Donald Trump and his racist and homophobic MAGA minions were elected by voters in November.

Now, America will go backward in time again.
#DemsUnited
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Recovered from a District Education Officer (DEO) in Bettiah, Bihar.

The scale of black wealth distribution
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In 2026, many flagship phones will come with 7000mAh battery

While battery of small phones will be 6000mAh battery

Also you'll see battery of smartphones going as high as around 8000mAh battery

All thanks to SiC batteries.
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TechInsights’ analysis of CXMT DDR5


TechInsights’ Comments on CXMT:

- CXMT has skipped the 17nm (D1y) node and directly transitioned to the 16nm (D1z) node.
- It is actively working on next-generation DRAM technology, including HBM, even for sub-15nm nodes without EUV lithography.

Key Takeaways:
- Despite the technological gap, CXMT has achieved a high bit density of 0.239 Gb/mm² at the D1z technology node, competing with major manufacturers.
- CXMT’s success in DDR5, now the mainstream technology in the DRAM market, highlights its potential to expand its market share in the global DRAM industry.
Report: The recent 6.4 earthquake caused greater damage to TSMC compared to the 7.2 magnitude earthquake in April last year.

According to Taiwanese media, approximately 30,000 wafers were damaged at each of TSMC’s Fab 14 and Fab 18 facilities, which produce 12-inch wafers in Tainan.

Furthermore, it was reported that the wafer damage at Fab 14, which produces mature process semiconductors, was more severe than at Fab 18, which manufactures advanced 3nm and 5nm process products. As a result, the total amount of damaged wafers is expected to exceed 20,000 units per month
Things Samsung removed in S series
Galaxy S10 > S20 heart rate sensor, bixby button,3.5mm jack

S20> S21 QHD,curved, plastic back, MST, microsd

s21 > S22 replaced the Note with S series, curved edges

S22 > S23 reduce curved, heating
S23> S24 curved, 10x telephoto
S24> S25 S pen Bluetooth, sharp edges

Galaxy S10 to S20 also entirely removed GearVR.

On S10 you could at least retain it if you stayed on OneUI3.x
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The Samsung Galaxy S25 supports seamless updates!
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In 2025, REDMI plans to focus on the 5000¥ price segment, positioning the K90 Pro between 4000¥ to 5000¥
The straight screen Flagship aims to compete directly with the Xiaomi 16
#Xiaomi #Redmi #RedmiK90 #RedmiK90Pro
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