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TSMC has placed more equipment orders to boost its CoWoS packaging manufacturing capability, according to sources at fab toolmakers.

TSMC has lately formulated strategies to enhance its advanced packaging capabilities, the sources said. As part of this initiative, TSMC intends to develop Advanced Backend Fab 7, its sixth backend fabrication facility, in Chiayi, a city situated in southern Taiwan. The factory is projected to be inaugurated in August 2025.

TSMC has also stepped up its pace of related equipment orders. Order visibility for fab tool suppliers has been extended through the end of 2024, the sources indicated.

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TSMC places additional equipment orders for CoWoS packaging
https://www.digitimes.com/news/a20240401PD234/tsmc-equipment-cowos-packaging.html
US Asks South Korea to Toughen Up Export Controls on China Chips

- Biden officials want Seoul to adopt similar tech curbs as US
- Washington is pushing for a deal before G7 summit in June

The US is asking South Korea to adopt restrictions on semiconductor technology exports to China similar to those Washington has already implemented, another sign the Biden administration is stepping up efforts to thwart Beijing’s chip ambitions. 

American officials want South Korea to restrict the flow of equipment and technologies for making high-end logic and memory chips to China, according to people familiar with the matter. Those include logic chips more advanced than 14-nanometer and a type of memory called DRAM beyond 18nm, one of the people said, asking not to be identified because the discussions are private. That would be consistent with a set of measures the US Department of Commerce first announced in 2022. 

American officials discussed the issues in depth with the government of South Korean President Yoon Suk Yeolin March, the people said. While the US is trying to reach an agreement before a G7 summit in mid-June, Seoul officials are debating whether to satisfy the US request, in part because China remains a key trading partner. 

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https://www.bnnbloomberg.ca/us-asks-south-korea-to-toughen-up-export-controls-on-china-chips-1.2054053
Apple unveils new AI model boosting Siri, rivals GPT-4 in performance (Digitimes)

- 애플은 최근 스크린과 대화 맥락상의 애매한 부분을 이해하도록 설계된 새로운 AI 모델을 발표

- 8천만, 2억 5천만, 10억, 30억의 네 가지 패러미터로 출시된 이 모델은 음성 비서 시리와의 사용자 상호 작용을 크게 향상시킬 것으로 알려짐

- 논문에서 애플의 AI 연구원들은 현재 상황과 언급된 사물 또는 개념을 이해하기 위해 음성 비서의 중요성을 강조. 따라서 사용자가 수동으로 작업을 수행할 필요 없이 음성 비서를 통해 명령할 수 있도록 하는 것

- 가장 작은 ReALM 모델도 기존 시스템에 비해 다양한 유형의 엔티티를 인식하는 데 5% 이상 정확도 향상

- 가장 작은 ReALM 모델은 GPT-4와 유사한 성능을 보이는 반면, 더 큰 버전은 GPT-4를 크게 능가하는 것으로 알려짐

https://www.digitimes.com/news/a20240402PD210/apple-siri-llm-ai-chatgpt.html
Intel discloses $7 billion operating loss for chip-making unit

- 2023년 인텔 파운드리 사업부 매출 $189억(-31% YoY), 영업적자 $70억(적자지속 YoY) 기록

- 인텔 CEO는 2024년 영업적자는 사상 최대치를 예상하며 2027년에서야 BEP 가능성 전망

https://www.reuters.com/technology/intel-discloses-financials-foundry-business-2024-04-02/
DB증권 Tech 서승연, 조현지
https://www.chinatimes.com/newspapers/20240404000174-260202
TSMC latest updates tonight: “Based on TSMC's rich experience and capability in earthquake response and disaster prevention, and regular safety drills to ensure full preparedness. Within just 10 hours after the earthquake on April 3rd, the recovery rate of wafer fab equipment has exceeded 70%, and the recovery rate of newly built fabs (such as Fab 18) has exceeded 80%. Although a few pieces of equipment in some areas were damaged, affecting production lines, major machines including all Extreme Ultraviolet (EUV) lithography equipment remained undamaged.

TSMC has allocated resources to expedite comprehensive recovery and has resumed operations today, maintaining close communication with our customers. We will continue to closely monitor and communicate directly with our customers about any relevant impacts.”